Jason Cong教授荣获2019年IEEE/ACM William J.McCalla ICCAD最佳论文奖！-新东方前途出国

　　Professor Jason Cong Awarded the 2019 IEEE/ACM William J. McCalla ICCAD Best Paper Award

　　Computer Science Professor Jason Cong, together with his co-authors Zhenyuan Ruan (former student, now at MIT), and Tong He (former student, now at Google), have received the 2019 IEEE/ACM William J. McCalla ICCAD Best Paper Award. This paper, “Analyzing and Modeling In-Storage Computing Workloads On EISC — An FPGA-Based System-Level Emulation Platform”, was published at the IEEE/ACM International Conference on Computer-Aided Design (ICCAD) from Nov. 4-6, 2019, in Denver, CO. 

　　计算机科学教授 Jason Cong 及其合著者 Zhenyuan Ruan（前麻省理工学院学生）、Tong He（前谷歌学生）获得了2019年IEEE/ACM威廉•麦卡拉ICCAD最佳论文奖。本文“基于FPGA的系统级仿真平台EISC存储计算工作负载分析与建模”于2019年11月4-6日在丹佛召开的IEEE/ACM国际计算机辅助设计会议（ICCAD）上发表。

　　Each November, this award is presented at ICCAD and is jointly sponsored by ACM/SIGDA, IEEE/CASS, and IEEE/CS. Papers are selected by the ICCAD Program Committee through a rigorous and multi-stage review process. This Award is given in the memory of William J. McCalla for his contributions to ICCAD and his CAD technical work throughout his career. This year, ICCAD had 394 submissions and accepted 94 papers. Only 2 papers out of the 94 accepted received the best paper award. 

　　每年11月，该奖项在ICCAD上颁发，由ACM/SIGDA、IEEE/CASS和IEEE/CS共同赞助。论文由ICCAD项目委员会通过严格的多阶段评审过程选出。这个奖项是为了纪念威廉J麦卡拉对ICCAD的贡献和他整个职业生涯中的CAD技术工作。今年，ICCAD共收到394篇论文，接受94篇论文。94篇论文中只有2篇获得了最佳论文奖。

　　About ICCAD: Jointly sponsored by IEEE and ACM, ICCAD has been the premier forum to explore emerging technology challenges in electronic design automation (EDA), present leading-edge R&D solutions, and identify future research directions. The ICCAD scope has also been adapted and expanded to address emerging technology, design, and automation challenges, including, but not limited to, those in AI, IoT, and security.

　　关于ICCAD：ICCAD由IEEE和ACM联合主办，是探索电子设计自动化（EDA）领域新技术挑战、提出前沿研发解决方案、确定未来研究方向的首要论坛。ICCAD的范围也被调整和扩展，以应对新出现的技术、设计和自动化挑战，包括但不限于人工智能、物联网和安全领域的挑战。

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