EE博士生Tingjun Chen在ACM MobiCom 2019学生研究竞赛（SRC）中获得第一名

　　Electrical Engineering Ph.D. student Tingjun Chen is the ACM MobiCom 2019 Student Research Competition (SRC) First Place Winner. He is a member of the Wireless & Mobile Networking (WiMNet) Research Lab, led by Professor Gil Zussman, which focuses on wireless, mobile, and resilient networks and systems. ACM MobiComis the flagship conference in the area of mobile computing and wireless networking, and this year’s conference was held in Oct. 21–25 at Los Cabos, Mexico. Tingjun will advance to the ACM SRC Grand Finals, where first place winners from various ACM Special Interest Groups (SIGs) are evaluated. The winners of the Grand Finals will be recognized at the Annual ACM Awards Banquet, the same banquet that also recognizes the Turing Award winners. 

　　电气工程博士生Tingjun Chen是ACM MobiCom 2019学生研究竞赛（SRC）的第一名得主,他是无线和移动网络（wimnet）研究实验室的成员，该实验室由gil zussman教授领导，专注于无线、移动和弹性网络和系统。ACM MobiMigMIS是移动计算和无线网络领域的旗舰会议，今年的会议于10月21日在墨西哥洛斯卡沃斯举行。Tingjun将晋级ACM SRC总决赛，各ACM特别兴趣小组（SIG）的第一名获胜者将接受评估总决赛的获胜者将在年度ACM颁奖盛宴上获得认可，同样的盛宴也会表彰图灵奖的获胜者。

　　Tingjun received the award in the graduate research category for his research project titled “Enabling wideband full-duplex via frequency-domain equalization”, which is joint work with EE students and alumni Mahmood Barrani Dastjerdi, Jackson Welles, Jin Zhou, and EE professors Harish Krishnaswamyand Gil Zussman. This work takes place within the Columbia FlexICoNproject and focuses on the design and evaluation of wideband full-duplex radios grounded in integrated circuit (IC) implementations that are more suitable for small-form-factor devices. Tingjun also presented the full paperabout this work at the MobiCom main conference as one of the 55 accepted papers out of 290 submissions (acceptance rate of 19.0%). The developed full-duplex radios were also recently integrated in the remotely-accessible city-scale NSF PAWR COSMOS testbed, thereby allowing the research community to experiment with full-duplex wireless. 

　　Tingjun因其“通过频域均衡实现宽带全双工”的研究项目获得了研究生研究类奖项，该项目是与EE学生和校友Mahmood Barrani Dastjerdi、Jackson Welles、Jin Zhou以及EE教授Harish Krishnaswamy和Gil Zussman共同合作的。这项工作是在哥伦比亚flexicon项目中进行的，重点是设计和评估更适合小尺寸器件的集成电路（ic）实现中接地的宽带全双工无线电。Tingjun还在莫比康大会上提交了关于这项工作的全部文件，作为290份提交文件中55份被接受的文件之一（接受率为19.0%）开发的全双工无线电最近也集成在可远程访问的城市级nsf-pawr-cosmos试验台上，从而使研究界能够试验全双工无线。

　　Tingjun received his B.Eng. in electronic engineering from Tsinghua University, China, in 2014 and his M.S. in electrical engineering from Columbia in 2015. His research interests are in the areas of wireless networking and systems with a focus on emerging technologies including ultra-low-power communication and IoT, full-duplex and millimeter-wave wireless, and optical-wireless networks and edge cloud. He has received a number of awards, including the Facebook Fellowship, the Wei Family Private Foundation Fellowship, the Columbia Electrical Engineering Armstrong Memorial Award and Millman Award, the Columbia Engineering Oscar and Verna Byron Fellowship, as well as the ACM CoNEXT 2016 Best Paper Awardand the ACM MobiHoc 2019 Best Paper Finalist. In September 2018, he was one of 200 young researchers from around the world selected to attend the sixth Heidelberg Laureate Forum. 

　　2014年，Tingjun在中国清华大学获得电子工程学士学位，2015年在哥伦比亚大学获得电子工程硕士学位他的研究兴趣是无线网络和系统领域，重点是新兴技术，包括超低功耗通信和物联网、全双工和毫米波无线、光无线网络和边缘云。他获得了许多奖项，包括Facebook奖学金、Wei Family Private Foundation奖学金、哥伦比亚电气工程阿姆斯特朗纪念奖和Millman奖、哥伦比亚工程奥斯卡奖和Verna Byron奖学金，以及ACM Conext 2016年度最佳论文奖和ACM Mobihoc 2019年度最佳论文决赛。2018年9月，他是全球200名入选第六届海德堡桂冠论坛的年轻研究人员之一。

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